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Narrow pitch mounting of 0402 and 0603 chips. Stacked mounting of chips in two layers.
The adjacent spacing between components has a proven record of up to 0.2mm. Stacking of 0603 chips in two layers is also possible.
The implementation components can accommodate high density and close proximity from 0402 to CSP, BGA, and more.
We have introduced two FUJI-made 7-head placement machines, the 'NXT IIIc', among our nine assembly lines. This has improved our assembly speed and enabled us to achieve higher density circuit board assembly. We are producing various high-density circuit boards for PCs, smartphones, tablets, and more. We also welcome factory tours, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to inquire.
